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Introduction 

With the high-purity (99.99%) Sn as raw material, the high-purity lead-free solder bar is used for wave soldering, dip soldering, especially for the automatic assembly line in mass production. This product meets the requirement of the EU RoHS environment directive. In order to meet the requirement of different soldering and adapt to a lot of operating methods , a variety of alloy composition and types of tin bar can be provided for users.

Characteristics

With the high-purity（99.99%) Sn as raw material and strict control of impurity content below 100ppm, the rate of tin slag is low, we can save the material cost about 16%. Excellent fluidity and wettability, the solder joint is bright and full, and the rate of bad solder joint is almost 0.

4-6 Lead-free Solder Bar Alloy Composition Selection Guide

4-6-1 Sn-Cu Alloys

4-6-2 Sn-Ag Alloys

4-6-3 Sn-Ag-Cu Alloys

4-6-4 Sn-Zn （Eutectic） alloys

4-6-5 Sn-Bi-X Alloys

4-6-6 Sn-Sb Alloys