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Home>Solder Paste Series>2-2 Non-halogen Lead-free Solder Paste
Solder Paste Series
2-2-1 characteristics
1. Adopt lead-free environment-protection alloy and helogeno-free flux, meet the RoHS directive.
2. New Technical support, special chemical ingredient, provide with favorable wettability to make up for poor wettability of lead-free alloy to ensure high reliability.
3. Little residue after reflowing which has no corrosion and good electrical insulation.
4 Adopt high-efficiency thixotropic agent to prevent subseidence as preheating and printing.
5. Meet the American standard of ANSI/J-STD-004 flux (ROLO).
6. The diameter of tin powder is accurately controlled between 25μm to 45μm, and the flux is specifically made to insure continuously printing and fine pattern.
7. Advanced moisture-keeping technology and persistent viscidity ( viscosity above 48 hours), more than 8 hours of valid working life.
8. The residue is clear and has little influence to test.
9. Lucent soldering point and other favorable performance.
2-2-2 Designation, Melting Point and Alloy Compositions
| Series | Melting point(℃) | Alloy compositions |
| WH-326G-R（2-2） | 217-220 | S-Sn96.5Ag3Cu0.5Ce |
| WH-373G-R（2-2） | 216-228 | S-Sn99Cu0.7Ag0.3 |
| WH-210G-R（2-2） | 340-240 | S-Sn95Sb5 |
2-2-3 Flux Chemical Composition
| Materials | Content(wt%) |
| Resin | 40 |
| Thixotropic agent | 11 |
| Acid | 3 |
| Solvent | 37 |
| Corrosion inhibitor | 3 |
| Viscosity additive | 2 |
| Active polymer | 2 |
2-2-4 Properties
| Item | Data | |
| Halogen content (%) | N.D | |
| SIR(Ω) | Before soldering | ＞1×1012 |
| Moist resistance | ＞1×1010 | |
| Flux content(Wt%) | 11.5±1.0 | |
| Metal content(Wt%) | 88.5±0.5 | |
| Powder size(μm) | 25~45 | |
| Viscosity (Kcps/Pa.s) | 180±30 | |
| Copper mirror corrosion | Low | |
| Copper plate corrosion | Low, accepted | |
| Collapse test | pass | |
| Wetting test | pass | |
| Shelf life | 6 Months (0-10℃) | |
